Apple this week unveiled the M1 Ultra-soc, which links two M1 Max chips together via an intercom. Currently, this processor can only be found in Mac Studio, which is expected to be available from March 18th. Given its potential computing power, the M1 Ultra will likely make its way to the next Mac Pro, although there is a new rumor pointing to a special app.
For example, Twitterer Majin Bu shared a drawing of a new type of bonding, which will be used to connect two M1 Ultras. Thus, this is the so-called Redfern processor consisting of four M1 Max chips, which should provide a configuration of a maximum of 40 CPU cores and 128 GPU cores. This is in line with a prediction made by Bloomberg in May last year, which mentioned 20 and 40 CPU cores (M1 Ultra and Redfern).
Mockup M1 Ultra Dual Sim (Source: Wccftech†
If Apple were indeed planning to develop such a chip, it would have as many as 228 billion transistors on board and would be at least 14 times larger than the original M1 soc. If we’re to believe Majin Bu, the first Mac Pro with this chip will hit the market in September of this year.
sources:
Majin Buu (Twitter)† Wccftech
“Thinker. Coffeeaholic. Award-winning gamer. Web trailblazer. Pop culture scholar. Beer guru. Food specialist.”
More Stories
Jupiter's moon Io was likely volcanically active billions of years ago
What we know about the new Chromecast with Google TV (4K)
Sony is rolling out a new PlayStation 5 system update that includes a handy Community Guide feature